carolinadaley
- 在住国：日本
- 現在地：未設定
- 出身国：日本
- 出身地：未設定
Flip Chip Ball Grid Range (BGA) packaging is a kind of integrated circuit product packaging that connects the semiconductor chip to the substrate utilizing solder bumps. The flip-chip style permits a greater density of connections as well as better electric performance than standard wire bonding.
投稿したプロジェクトはまだありません。
