owtemperaturecuring

• 在住国：日本
• 現在地：未設定

• 出身国：日本
• 出身地：千葉県

This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.

• www.deepmaterialcn.com/low-temperatur...
• www.pinterest.com/owtemperaturecuring/
• www.youtube.com/channel/UCh3aSFhccTUi...
• flipboard.com/@lowtemperat34l8/
• www.walkscore.com/people/662034579895...