eucleveladhesives

• 在住国：日本
• 現在地：未設定

• 出身国：日本
• 出身地：未設定

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/

• www.epoxyadhesiveglue.com/product/epo...
• www.pinterest.com/echipleveladhesives/
• www.linkedin.com/in/eucleveladhesives/
• www.credly.com/users/epoxy-underfill-...
• eucleveladhesives.carrd.co/